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(parent: d613746) | patch
usb: musb: introduce DA8xx/OMAP-L1x glue layer
authorSergei Shtylyov <sshtylyov@ru.mvista.com>
Fri, 24 Sep 2010 10:44:03 +0000 (13:44 +0300)
committerGreg Kroah-Hartman <gregkh@suse.de>
Fri, 22 Oct 2010 17:21:52 +0000 (10:21 -0700)
commit3ee076dea68e11d4685972df7298b80b8e7673e4
treed9f962a3f95d88efc663b3d6b4c7920ec9632a4etree | snapshot
parentd613746d8bc3a2904d4585d7efd7f457d9db6fb9commit | diff
usb: musb: introduce DA8xx/OMAP-L1x glue layer

Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.

Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
drivers/usb/musb/Kconfig diff | blob | history
drivers/usb/musb/Makefile diff | blob | history
drivers/usb/musb/da8xx.c [new file with mode: 0644] blob
drivers/usb/musb/musb_core.h diff | blob | history
Linux kernel for KaRo TX COM modules