X-Git-Url: https://git.kernelconcepts.de/?p=karo-tx-uboot.git;a=blobdiff_plain;f=include%2Fddr_spd.h;h=cf2aac6ae4274735140260e87edf98f105e78f0c;hp=15a3e8d35181ddf71a765d32391f55610e7958bd;hb=5121b8df014a80499a0d683f668804178daf0bac;hpb=55aea84b1db277bd86edadb37d11b78d36db7608 diff --git a/include/ddr_spd.h b/include/ddr_spd.h index 15a3e8d351..cf2aac6ae4 100644 --- a/include/ddr_spd.h +++ b/include/ddr_spd.h @@ -1,5 +1,5 @@ /* - * Copyright 2008 Freescale Semiconductor, Inc. + * Copyright 2008-2014 Freescale Semiconductor, Inc. * * This program is free software; you can redistribute it and/or * modify it under the terms of the GNU General Public License @@ -290,11 +290,220 @@ typedef struct ddr3_spd_eeprom_s { } ddr3_spd_eeprom_t; +/* From JEEC Standard No. 21-C release 23A */ +struct ddr4_spd_eeprom_s { + /* General Section: Bytes 0-127 */ + uint8_t info_size_crc; /* 0 # bytes */ + uint8_t spd_rev; /* 1 Total # bytes of SPD */ + uint8_t mem_type; /* 2 Key Byte / mem type */ + uint8_t module_type; /* 3 Key Byte / Module Type */ + uint8_t density_banks; /* 4 Density and Banks */ + uint8_t addressing; /* 5 Addressing */ + uint8_t package_type; /* 6 Package type */ + uint8_t opt_feature; /* 7 Optional features */ + uint8_t thermal_ref; /* 8 Thermal and refresh */ + uint8_t oth_opt_features; /* 9 Other optional features */ + uint8_t res_10; /* 10 Reserved */ + uint8_t module_vdd; /* 11 Module nominal voltage */ + uint8_t organization; /* 12 Module Organization */ + uint8_t bus_width; /* 13 Module Memory Bus Width */ + uint8_t therm_sensor; /* 14 Module Thermal Sensor */ + uint8_t ext_type; /* 15 Extended module type */ + uint8_t res_16; + uint8_t timebases; /* 17 MTb and FTB */ + uint8_t tck_min; /* 18 tCKAVGmin */ + uint8_t tck_max; /* 19 TCKAVGmax */ + uint8_t caslat_b1; /* 20 CAS latencies, 1st byte */ + uint8_t caslat_b2; /* 21 CAS latencies, 2nd byte */ + uint8_t caslat_b3; /* 22 CAS latencies, 3rd byte */ + uint8_t caslat_b4; /* 23 CAS latencies, 4th byte */ + uint8_t taa_min; /* 24 Min CAS Latency Time */ + uint8_t trcd_min; /* 25 Min RAS# to CAS# Delay Time */ + uint8_t trp_min; /* 26 Min Row Precharge Delay Time */ + uint8_t tras_trc_ext; /* 27 Upper Nibbles for tRAS and tRC */ + uint8_t tras_min_lsb; /* 28 tRASmin, lsb */ + uint8_t trc_min_lsb; /* 29 tRCmin, lsb */ + uint8_t trfc1_min_lsb; /* 30 Min Refresh Recovery Delay Time */ + uint8_t trfc1_min_msb; /* 31 Min Refresh Recovery Delay Time */ + uint8_t trfc2_min_lsb; /* 32 Min Refresh Recovery Delay Time */ + uint8_t trfc2_min_msb; /* 33 Min Refresh Recovery Delay Time */ + uint8_t trfc4_min_lsb; /* 34 Min Refresh Recovery Delay Time */ + uint8_t trfc4_min_msb; /* 35 Min Refresh Recovery Delay Time */ + uint8_t tfaw_msb; /* 36 Upper Nibble for tFAW */ + uint8_t tfaw_min; /* 37 tFAW, lsb */ + uint8_t trrds_min; /* 38 tRRD_Smin, MTB */ + uint8_t trrdl_min; /* 39 tRRD_Lmin, MTB */ + uint8_t tccdl_min; /* 40 tCCS_Lmin, MTB */ + uint8_t res_41[60-41]; /* 41 Rserved */ + uint8_t mapping[78-60]; /* 60~77 Connector to SDRAM bit map */ + uint8_t res_78[117-78]; /* 78~116, Reserved */ + int8_t fine_tccdl_min; /* 117 Fine offset for tCCD_Lmin */ + int8_t fine_trrdl_min; /* 118 Fine offset for tRRD_Lmin */ + int8_t fine_trrds_min; /* 119 Fine offset for tRRD_Smin */ + int8_t fine_trc_min; /* 120 Fine offset for tRCmin */ + int8_t fine_trp_min; /* 121 Fine offset for tRPmin */ + int8_t fine_trcd_min; /* 122 Fine offset for tRCDmin */ + int8_t fine_taa_min; /* 123 Fine offset for tAAmin */ + int8_t fine_tck_max; /* 124 Fine offset for tCKAVGmax */ + int8_t fine_tck_min; /* 125 Fine offset for tCKAVGmin */ + /* CRC: Bytes 126-127 */ + uint8_t crc[2]; /* 126-127 SPD CRC */ + + /* Module-Specific Section: Bytes 128-255 */ + union { + struct { + /* 128 (Unbuffered) Module Nominal Height */ + uint8_t mod_height; + /* 129 (Unbuffered) Module Maximum Thickness */ + uint8_t mod_thickness; + /* 130 (Unbuffered) Reference Raw Card Used */ + uint8_t ref_raw_card; + /* 131 (Unbuffered) Address Mapping from + Edge Connector to DRAM */ + uint8_t addr_mapping; + /* 132~253 (Unbuffered) Reserved */ + uint8_t res_132[254-132]; + /* 254~255 CRC */ + uint8_t crc[2]; + } unbuffered; + struct { + /* 128 (Registered) Module Nominal Height */ + uint8_t mod_height; + /* 129 (Registered) Module Maximum Thickness */ + uint8_t mod_thickness; + /* 130 (Registered) Reference Raw Card Used */ + uint8_t ref_raw_card; + /* 131 DIMM Module Attributes */ + uint8_t modu_attr; + /* 132 RDIMM Thermal Heat Spreader Solution */ + uint8_t thermal; + /* 133 Register Manufacturer ID Code, LSB */ + uint8_t reg_id_lo; + /* 134 Register Manufacturer ID Code, MSB */ + uint8_t reg_id_hi; + /* 135 Register Revision Number */ + uint8_t reg_rev; + /* 136 Address mapping from register to DRAM */ + uint8_t reg_map; + /* 137~253 Reserved */ + uint8_t res_137[254-137]; + /* 254~255 CRC */ + uint8_t crc[2]; + } registered; + struct { + /* 128 (Loadreduced) Module Nominal Height */ + uint8_t mod_height; + /* 129 (Loadreduced) Module Maximum Thickness */ + uint8_t mod_thickness; + /* 130 (Loadreduced) Reference Raw Card Used */ + uint8_t ref_raw_card; + /* 131 DIMM Module Attributes */ + uint8_t modu_attr; + /* 132 RDIMM Thermal Heat Spreader Solution */ + uint8_t thermal; + /* 133 Register Manufacturer ID Code, LSB */ + uint8_t reg_id_lo; + /* 134 Register Manufacturer ID Code, MSB */ + uint8_t reg_id_hi; + /* 135 Register Revision Number */ + uint8_t reg_rev; + /* 136 Address mapping from register to DRAM */ + uint8_t reg_map; + /* 137 Register Output Drive Strength for CMD/Add*/ + uint8_t reg_drv; + /* 138 Register Output Drive Strength for CK */ + uint8_t reg_drv_ck; + /* 139 Data Buffer Revision Number */ + uint8_t data_buf_rev; + /* 140 DRAM VrefDQ for Package Rank 0 */ + uint8_t vrefqe_r0; + /* 141 DRAM VrefDQ for Package Rank 1 */ + uint8_t vrefqe_r1; + /* 142 DRAM VrefDQ for Package Rank 2 */ + uint8_t vrefqe_r2; + /* 143 DRAM VrefDQ for Package Rank 3 */ + uint8_t vrefqe_r3; + /* 144 Data Buffer VrefDQ for DRAM Interface */ + uint8_t data_intf; + /* + * 145 Data Buffer MDQ Drive Strength and RTT + * for data rate <= 1866 + */ + uint8_t data_drv_1866; + /* + * 146 Data Buffer MDQ Drive Strength and RTT + * for 1866 < data rate <= 2400 + */ + uint8_t data_drv_2400; + /* + * 147 Data Buffer MDQ Drive Strength and RTT + * for 2400 < data rate <= 3200 + */ + uint8_t data_drv_3200; + /* 148 DRAM Drive Strength */ + uint8_t dram_drv; + /* + * 149 DRAM ODT (RTT_WR, RTT_NOM) + * for data rate <= 1866 + */ + uint8_t dram_odt_1866; + /* + * 150 DRAM ODT (RTT_WR, RTT_NOM) + * for 1866 < data rate <= 2400 + */ + uint8_t dram_odt_2400; + /* + * 151 DRAM ODT (RTT_WR, RTT_NOM) + * for 2400 < data rate <= 3200 + */ + uint8_t dram_odt_3200; + /* + * 152 DRAM ODT (RTT_PARK) + * for data rate <= 1866 + */ + uint8_t dram_odt_park_1866; + /* + * 153 DRAM ODT (RTT_PARK) + * for 1866 < data rate <= 2400 + */ + uint8_t dram_odt_park_2400; + /* + * 154 DRAM ODT (RTT_PARK) + * for 2400 < data rate <= 3200 + */ + uint8_t dram_odt_park_3200; + uint8_t res_155[254-155]; /* Reserved */ + /* 254~255 CRC */ + uint8_t crc[2]; + } loadreduced; + uint8_t uc[128]; /* 128-255 Module-Specific Section */ + } mod_section; + + uint8_t res_256[320-256]; /* 256~319 Reserved */ + + /* Module supplier's data: Byte 320~383 */ + uint8_t mmid_lsb; /* 320 Module MfgID Code LSB */ + uint8_t mmid_msb; /* 321 Module MfgID Code MSB */ + uint8_t mloc; /* 322 Mfg Location */ + uint8_t mdate[2]; /* 323~324 Mfg Date */ + uint8_t sernum[4]; /* 325~328 Module Serial Number */ + uint8_t mpart[20]; /* 329~348 Mfg's Module Part Number */ + uint8_t mrev; /* 349 Module Revision Code */ + uint8_t dmid_lsb; /* 350 DRAM MfgID Code LSB */ + uint8_t dmid_msb; /* 351 DRAM MfgID Code MSB */ + uint8_t stepping; /* 352 DRAM stepping */ + uint8_t msd[29]; /* 353~381 Mfg's Specific Data */ + uint8_t res_382[2]; /* 382~383 Reserved */ + + uint8_t user[512-384]; /* 384~511 End User Programmable */ +}; + extern unsigned int ddr1_spd_check(const ddr1_spd_eeprom_t *spd); extern void ddr1_spd_dump(const ddr1_spd_eeprom_t *spd); extern unsigned int ddr2_spd_check(const ddr2_spd_eeprom_t *spd); extern void ddr2_spd_dump(const ddr2_spd_eeprom_t *spd); extern unsigned int ddr3_spd_check(const ddr3_spd_eeprom_t *spd); +unsigned int ddr4_spd_check(const struct ddr4_spd_eeprom_s *spd); /* * Byte 2 Fundamental Memory Types. @@ -310,6 +519,7 @@ extern unsigned int ddr3_spd_check(const ddr3_spd_eeprom_t *spd); #define SPD_MEMTYPE_DDR2_FBDIMM (0x09) #define SPD_MEMTYPE_DDR2_FBDIMM_PROBE (0x0A) #define SPD_MEMTYPE_DDR3 (0x0B) +#define SPD_MEMTYPE_DDR4 (0x0C) /* DIMM Type for DDR2 SPD (according to v1.3) */ #define DDR2_SPD_DIMMTYPE_UNDEFINED (0x00) @@ -338,4 +548,18 @@ extern unsigned int ddr3_spd_check(const ddr3_spd_eeprom_t *spd); #define DDR3_SPD_MODULETYPE_16B_SO_DIMM (0x0C) #define DDR3_SPD_MODULETYPE_32B_SO_DIMM (0x0D) +/* DIMM Type for DDR4 SPD */ +#define DDR4_SPD_MODULETYPE_MASK (0x0f) +#define DDR4_SPD_MODULETYPE_EXT (0x00) +#define DDR4_SPD_MODULETYPE_RDIMM (0x01) +#define DDR4_SPD_MODULETYPE_UDIMM (0x02) +#define DDR4_SPD_MODULETYPE_SO_DIMM (0x03) +#define DDR4_SPD_MODULETYPE_LRDIMM (0x04) +#define DDR4_SPD_MODULETYPE_MINI_RDIMM (0x05) +#define DDR4_SPD_MODULETYPE_MINI_UDIMM (0x06) +#define DDR4_SPD_MODULETYPE_72B_SO_UDIMM (0x08) +#define DDR4_SPD_MODULETYPE_72B_SO_RDIMM (0x09) +#define DDR4_SPD_MODULETYPE_16B_SO_DIMM (0x0C) +#define DDR4_SPD_MODULETYPE_32B_SO_DIMM (0x0D) + #endif /* _DDR_SPD_H_ */