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(parent: df09df6) | patch
ARM: dts: Add CPU cooling binding for exynos3250 boards
authorChanwoo Choi <cw00.choi@samsung.com>
Thu, 30 Jul 2015 14:02:22 +0000 (23:02 +0900)
committerKukjin Kim <kgene@kernel.org>
Thu, 13 Aug 2015 17:08:56 +0000 (02:08 +0900)
commit5600f8cc8aa8bdcf335e84a7f85eae204b379bae
tree0b8795c51f946c2aa5d67c64c35aed4ae62411a5tree | snapshot
parentdf09df6f9ac384fef825c2c21c62cd576acda17fcommit | diff
ARM: dts: Add CPU cooling binding for exynos3250 boards

This patch add the cooling device to control the overheating issue on
Exynos3250-based Rinato/Monk board.

Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Acked-by Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
arch/arm/boot/dts/exynos3250-monk.dts diff | blob | history
arch/arm/boot/dts/exynos3250-rinato.dts diff | blob | history
arch/arm/boot/dts/exynos3250.dtsi diff | blob | history
Linux kernel for KaRo TX COM modules